BiTS 사업소개


  • PION
    * Product Descriptions
    - Applications : package test socket, wafer level test socket, burn-in socket,
    interposer (PCB, CSP, WLCSP, QFN, etc)

    * Advantages
    - Ultra fine pitch support thru MEMs manufacturing
    - Lowest cost ever any pitch type of device testing
    - Quick turn design support for custom requirements
    - Long insertion with good electrical properies
    - Fast lead time for high vomume production
    - Short Length adhievable