A New Partnership for Innovation and Advancement in the Global Semiconductor Industry
Semiconductor Division
The Semiconductor Division of OKins Electronics provides comprehensive test services for semiconductor wafers and packaged ICs designed and manufactured by fabless companies and design houses, based on advanced semiconductor testing technologies.
Business Areas
Semiconductor Test Development (Application Development)
• Test Program Development
• Test Hardware Development
– Test Board & Jig Development
– Probe Card Development
– Test Socket Development
Wafer Test
• Typical Non-Memory Wafer Probing Test
– 5”, 6”, 8”, 12” inch Wafer loading
• Temperature Range : -40℃ ~ 150℃
• Wafer Burn-in Test – Being prepared
Package Final Test
• Testing of Various Package Types
• Test Hardware Development
– BGA, QFN, DFN, ODFN, SOP, TSSOP, etc.
• Package Burn-in Test – Being prepared
Key Product Categories for Testing
• Analog IC
• Automotive Power IC
• Digital Logic IC
• Sensor Device & ROIC
• Optical Sensor IC
• Mixed Signal IC
• Power Management IC
• Power Discrete
– MOSFET : Super Junction, LV, SiC, GaN, SGT
– IGBT (with Taiko type)
• Wafer & Package IC Burn-in Test
