BiTS Business Unit
PION
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- PION
- Contact
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* Product Descriptions
- Applications : package test socket, wafer level test socket, burn-in socket,
interposer (PCB, CSP, WLCSP, QFN, etc)
* Advantages
- Ultra fine pitch support thru MEMs manufacturing
- Lowest cost ever any pitch type of device testing
- Quick turn design support for custom requirements
- Long insertion with good electrical properies
- Fast lead time for high vomume production
- Short Length adhievable
